The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Feb. 05, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Can Bayram, Ossining, NY (US);

Jack O. Chu, Manhasset Hills, NY (US);

Christos Dimitrakopoulos, Baldwin Place, NY (US);

Jeehwan Kim, White Plains, NY (US);

Hongsik Park, Yorktown Heights, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/14 (2010.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/14 (2013.01); H01L 21/02378 (2013.01); H01L 21/02527 (2013.01); H01L 21/02612 (2013.01); H01L 33/0093 (2020.05); H01L 2924/0002 (2013.01);
Abstract

An electronic device includes a spreading layer and a first contact layer formed over and contacting the spreading layer. The first contact layer is formed from a thermally conductive crystalline material having a thermal conductivity greater than or equal to that of an active layer material. An active layer includes one or more III-nitride layers. A second contact layer is formed over the active layer, wherein the active layer is disposed vertically between the first and second contact layers to form a vertical thin film stack.


Find Patent Forward Citations

Loading…