The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Mar. 12, 2018
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Aaron J. Francis, Apex, NC (US);

Jasper Sicat Cabalu, Apex, NC (US);

Colin Kelly Blakely, Franklinton, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/08 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 33/08 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01);
Abstract

Light emitting diode (LED) components include a submount, at least one or more LED chip wirebonded on a first surface of the submount to electrical traces at the edges of the submount, and a molded encapsulant which is devoid of a curved lens or hemispherical lens and can have outer or lateral walls co-planar with exterior walls of the submount. An LED component can have a viewing angle that is greater than 125°. A method of providing an LED component includes providing a substantially flat submount, attaching one or more LED chip over a first surface of the submount, dispensing an encapsulant over the first surface of the submount over the LED chips, applying a press over the encapsulant to apply a heat and/or pressure to the encapsulant, and molding the encapsulant over the first surface of the submount.


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