The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Jan. 24, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Young Bae Kim, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49 (2013.01); H01L 23/3114 (2013.01); H01L 24/08 (2013.01);
Abstract
A semiconductor package includes a package substrate, a flip chip coupled to the package substrate, an interposer stacked on the flip chip and including a first terminal and a second terminal at an upper surface thereof, a bonding wire which connects the first terminal and the package substrate and a mold layer which covers the interposer, the flip chip and the bonding wire. The mold layer has a signal hole which exposes the second terminal, and at least one dummy hole spaced apart from the signal hole on an upper surface of the interposer.