The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
May. 29, 2019
Apex Microtechnology, Inc., Tucson, AZ (US);
Apex Microtechnology, Inc., Tucson, AZ (US);
Abstract
Disclosed herein are apparatuses and methods for configuring a circuit board to have a plurality of die having different bottom-side electrical potential. An apparatus comprises a circuit board comprising a metallic base plate, a thermally conductive dielectric, and a plurality of metallic pads. Each of a plurality of die of the apparatus is coupled to a respective one of the plurality of metallic pads, and the plurality of die comprises a first die and a second die. Based on each of the plurality of die being coupled to a respective one of the plurality of metallic foil pads, the first die is configured to exhibit a first bottom-side electrical potential and the second die is configured to exhibit a second bottom-side electrical potential. The apparatus is further configured to conduct heat from the plurality of die away from the plurality of die via at least the metallic base plate, the thermally conductive dielectric, and the plurality of metallic pads.