The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Mar. 31, 2017
Applicant:

Electro Scientific Industries, Inc., Portland, OR (US);

Inventors:

Joel Schrauben, Portland, OR (US);

Jan Kleinert, Portland, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01);
Abstract

A workpiece () having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (), such as a metal, onto the glass substrate, especially into the recessed features (). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features () with predictable and better electrical properties. The workpieces () can be connected in a stacked such that subsequently stacked workpieces () can be modified in place.


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