The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Oct. 03, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Chen Zhang, Albany, NY (US);

Zuoguang Liu, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/088 (2006.01); H01L 29/786 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/775 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823487 (2013.01); H01L 21/823425 (2013.01); H01L 21/823475 (2013.01); H01L 21/823481 (2013.01); H01L 22/14 (2013.01); H01L 22/32 (2013.01); H01L 22/34 (2013.01); H01L 27/088 (2013.01); H01L 29/66666 (2013.01);
Abstract

The present invention provides VFET device designs for top contact resistance measurement. In one aspect, a method of forming a VFET test structure includes: etching fins in a substrate (for active and sensing devices); forming bottom source/drains at a base of the fins; forming a STI region that isolates the bottom source/drains of the active device from that of the sensing device; forming a gate surrounding each of the fins; forming top source/drains over the gate, wherein the top source/drains of the active device and that of the sensing device are merged; and forming contacts to i) the bottom source/drains of the active device, ii) the top source/drains of the active device, and iii) the bottom source/drains of the sensing device. A test structure formed by the method as well as techniques for use thereof for measuring contact resistance are also provided.


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