The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Feb. 10, 2020
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Han-Ping Chen, Santa Clara, CA (US);

Wei Zhao, Fremont, CA (US);

Henry Chin, Fremont, CA (US);

Assignee:

SanDisk Technologies LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/10 (2006.01); G11C 16/04 (2006.01); G11C 16/08 (2006.01); H01L 27/11582 (2017.01); H01L 27/1157 (2017.01); G11C 16/34 (2006.01);
U.S. Cl.
CPC ...
G11C 16/10 (2013.01); G11C 16/0483 (2013.01); G11C 16/08 (2013.01); H01L 27/1157 (2013.01); H01L 27/11582 (2013.01); G11C 16/3459 (2013.01);
Abstract

Apparatuses and techniques are described for pre-charging NAND string channels in a pre-charge phase of a program operation. In one aspect, a hole-type pre-charge process is used at the source end of a NAND string, where a bottom of the NAND string is connected to a p-well of a substrate. By applying a positive voltage to the p-well and a lower voltage, such as 0 V or a negative voltage, to the source-side select gate transistors and the memory cells, the holes from the p-well are injected into the channel In another approach, the hole-type pre-charge process and an electron-type pre-charge process are used sequentially in separate time periods. In another approach, the hole-type pre-charge process is used at the source end of a NAND string while the electron-type pre-charge process is used at the drain end of the NAND string.


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