The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Jul. 11, 2018
Applicant:

Korea Advanced Institute of Science and Technology, Daejeon, KR;

Inventors:

Yang-Kyu Choi, Daejeon, KR;

Jun-Young Park, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 21/79 (2013.01); G11C 13/00 (2006.01); G11C 16/34 (2006.01); H05B 3/00 (2006.01); G11C 16/22 (2006.01); G11C 16/30 (2006.01); G11C 11/16 (2006.01); G11C 16/14 (2006.01); G11C 7/04 (2006.01); G11C 16/10 (2006.01); H05B 3/26 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
G06F 21/79 (2013.01); G11C 7/04 (2013.01); G11C 11/1675 (2013.01); G11C 11/1695 (2013.01); G11C 11/1697 (2013.01); G11C 13/0002 (2013.01); G11C 13/0004 (2013.01); G11C 13/0016 (2013.01); G11C 13/0038 (2013.01); G11C 13/0059 (2013.01); G11C 13/0069 (2013.01); G11C 13/0097 (2013.01); G11C 16/10 (2013.01); G11C 16/14 (2013.01); G11C 16/22 (2013.01); G11C 16/30 (2013.01); G11C 16/3445 (2013.01); H05B 3/00 (2013.01); H05B 3/26 (2013.01); G06F 2221/2143 (2013.01); G11C 2013/008 (2013.01); H01L 23/345 (2013.01);
Abstract

The present invention provides a thermal hardware-based data security device that is capable of physically, hardware-wise, and permanently erasing data stored in a memory and of enabling a storage device to be reused, and a method thereof. The thermal hardware-based data security device includes: a memory chip capable of storing data; a heater module which supplies heat to permanently erase the data stored in a memory cell within the memory chip; and a switch module which short-circuits the heater module between a power supply unit and a ground when switched on, and thus, controls the heater module to be operated.


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