The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Feb. 21, 2018
Applicants:

Safran Electronics & Defense, Boulogne Billancourt, FR;

Centre National DE LA Recherche Scientifique, Paris, FR;

Inventors:

Romain Breuneval, Boulogne Billancourt, FR;

Badr Mansouri, Boulogne Billancourt, FR;

Emmanuel Boutleux, Boulogne Billancourt, FR;

Guy Clerc, Boulogne Billancourt, FR;

Julien Huillery, Boulogne Billancourt, FR;

Ryan Michaud, Boulogne Billancourt, FR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/34 (2020.01); G01M 13/02 (2019.01); G01R 31/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/343 (2013.01); G01M 13/02 (2013.01); G01R 31/008 (2013.01);
Abstract

A monitoring method for monitoring equipment of electromechanical actuator type, the equipment including a three-phase electric motor, the monitoring method comprising the following steps: measuring three-phase currents powering the three-phase electric motor; projecting the three-phase currents into a Park reference frame; performing an ensemblist empirical mode decomposition processor the quadrature current coupled with a blind source separation process in order to obtain source components; from among the source components, automatically selecting a first set of source components sensitive to a first defect, and a second set of source components sensitive to a second defect; constructing a first virtual defect signal and a second virtual defect signal; and extracting a first set of signatures representative of the first defect from the first virtual defect signal, and extracting a second set of signatures representative of the second defect from the second virtual defect signal.


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