The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Feb. 22, 2018
Applicants:

Ngk Insulators, Ltd., Nagoya, JP;

National University Corporation Yokohama National University, Yokohama, JP;

Inventors:

Mahoto Takeda, Yokohama, JP;

Koudai Sasaki, Yokohama, JP;

Naokuni Muramatsu, Nagoya, JP;

Takanari Nakajima, Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 9/02 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01); C22C 9/01 (2006.01); C22C 9/05 (2006.01);
U.S. Cl.
CPC ...
C22C 9/02 (2013.01); C22C 9/05 (2013.01); C22F 1/00 (2013.01); C22F 1/006 (2013.01); C22F 1/08 (2013.01); C22C 9/01 (2013.01);
Abstract

A copper alloy disclosed in the present description has a basic alloy composition represented by CuSnAl(where 8≤x≤12 and 8≤y≤9 are satisfied), in which a main phase is a βCuSn phase with Al dissolved therein, and the βCuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by CuSnAl(where 8≤x≤12 and 8≤y≤9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a βCuSn phase so as to obtain a homogenized material, the method includes at least the casting step.


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