The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Feb. 02, 2016
Applicant:

National Research Council of Canada, Ottawa, CA;

Inventors:

Chantal Paquet, Carp, CA;

Thomas Lacelle, Kanata, CA;

Patrick R. L. Malenfant, Orleans, CA;

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); C09D 11/037 (2014.01); C09D 11/033 (2014.01); C09D 11/36 (2014.01); H05K 1/03 (2006.01); C09D 11/322 (2014.01); C09D 11/32 (2014.01); C08J 7/06 (2006.01); B29C 71/02 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C08J 7/065 (2013.01); C08J 7/08 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/32 (2013.01); C09D 11/36 (2013.01); H05K 1/097 (2013.01); H05K 3/1283 (2013.01); C08J 2379/08 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/0162 (2013.01);
Abstract

A copper precursor composition contains: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and, a second copper complex of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper precursor composition contains a copper complex of an imine coordinated to a copper precursor compound. The copper precursor composition is thermally degradable at a temperature lower than a comparable composition containing only primary amine copper complexes under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 μΩ-cm or less. Inks containing the copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate with the film thereon is useful in electronic devices.


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