The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Mar. 17, 2016
Applicant:
Nippon Electric Glass Co., Ltd., Otsu, JP;
Inventor:
Takahiro Matano, Otsu, JP;
Assignee:
NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 13/00 (2006.01); C08K 7/20 (2006.01); C08K 3/40 (2006.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); C08K 3/20 (2006.01); C08L 101/00 (2006.01); B29C 64/135 (2017.01); B29K 509/08 (2006.01);
U.S. Cl.
CPC ...
C08K 7/20 (2013.01); B29C 64/135 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08K 3/20 (2013.01); C08K 3/40 (2013.01); C08L 101/00 (2013.01); B29K 2509/08 (2013.01); C08K 2201/005 (2013.01); C08K 2201/006 (2013.01);
Abstract
Provided is a resin composition for three-dimensional modeling that can accurately fabricate a three-dimensional modeled object capable of being matched in coefficient of thermal expansion with surrounding members when used as a component in various devices. The resin composition for three-dimensional modeling contains a curable resin and a glass filler, the glass filler having a coefficient of thermal expansion of 60×10/° C. or less at −40 to 50° C. and compositionally containing 90% by mass or less SiO.