The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Jun. 04, 2019
Applicant:
Csem Centre Suisse D'electronique ET DE Microtechnique Sa—recherche ET Développement, Neuchâtel, CH;
Inventors:
Nicolas Blondiaux, Les Geneveys-sur-Coffrane, CH;
Raphaël Pugin, Colombier, CH;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
B81C 99/00 (2010.01); B81C 1/00 (2006.01); B81B 5/00 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
B81C 99/0085 (2013.01); B81C 1/00103 (2013.01); B81C 1/00484 (2013.01); B81C 99/009 (2013.01); B81B 5/00 (2013.01); B81B 2201/035 (2013.01); B81B 2201/036 (2013.01); B81C 2201/034 (2013.01); B82Y 40/00 (2013.01);
Abstract
Method of manufacturing a micromechanical component intended to cooperate with another micromechanical component, the method comprising the steps of providing a substrate, forming a mould on said substrate, said mould defining sidewalls arranged to delimit said micromechanical component, providing particles on at least said sidewalls, depositing a metal in said mould so as to form said micromechanical component, and liberating said micromechanical component from said mould and removing said particles.