The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Oct. 20, 2017
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Thomas Michael Cleary, Elmira, NY (US);

Yawei Sun, Elmira, NY (US);

Chunhe Zhang, Horseheads, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01); B29C 65/00 (2006.01); B32B 37/00 (2006.01); B32B 3/26 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B29L 31/34 (2006.01); B32B 38/18 (2006.01); B32B 17/10 (2006.01); B32B 17/06 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); C03C 3/091 (2006.01); C03C 3/093 (2006.01);
U.S. Cl.
CPC ...
B32B 37/10 (2013.01); B29C 66/81463 (2013.01); B29C 66/81465 (2013.01); B32B 3/266 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); B32B 17/06 (2013.01); B32B 17/064 (2013.01); B32B 17/10036 (2013.01); B32B 17/1077 (2013.01); B32B 17/10119 (2013.01); B32B 17/10137 (2013.01); B32B 17/10743 (2013.01); B32B 17/10761 (2013.01); B32B 17/10788 (2013.01); B32B 17/10816 (2013.01); B32B 17/10862 (2013.01); B32B 37/0046 (2013.01); B32B 37/12 (2013.01); B32B 37/18 (2013.01); C03C 3/091 (2013.01); C03C 3/093 (2013.01); B29L 2031/3475 (2013.01); B32B 38/1866 (2013.01); B32B 2250/02 (2013.01);
Abstract

In some embodiments, a process comprises applying an adhesive layer to a substrate having a developable shape. The process further comprises initially applying a force to press a thin glass layer against the adhesive layer along a generation line. The generation line moves across the substrate to cold-form the thin glass layer into the shape of the substrate, while maintaining the application of force on areas of the substrate over which the generation line has passed. The application of force is maintained on areas of the substrate over which the generation line has passed until the adhesive cures.


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