The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Aug. 27, 2013
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Kiat Chyai Kang, Painted Post, NY (US);

Govindarajan Natarajan, Poughkeepsie, NY (US);

Yu Xiao, Pittsford, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/02 (2006.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); B29C 65/54 (2006.01); B29C 65/00 (2006.01); B32B 27/30 (2006.01); B29K 105/00 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B32B 17/064 (2013.01); B29C 65/02 (2013.01); B29C 65/54 (2013.01); B29C 66/7465 (2013.01); B32B 7/12 (2013.01); B32B 17/101 (2013.01); B32B 17/10018 (2013.01); B32B 17/10036 (2013.01); B32B 17/10743 (2013.01); B32B 17/10752 (2013.01); B32B 27/06 (2013.01); B32B 27/308 (2013.01); B29K 2105/0097 (2013.01); B29K 2105/253 (2013.01); B29K 2833/12 (2013.01); B29K 2909/08 (2013.01); B29K 2995/0026 (2013.01); B29L 2009/00 (2013.01); B29L 2031/3412 (2013.01); B32B 2250/02 (2013.01); B32B 2255/10 (2013.01); B32B 2457/00 (2013.01); Y10T 428/24628 (2015.01); Y10T 428/266 (2015.01);
Abstract

A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.


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