The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Sep. 29, 2015
Applicant:

Toshiba Mitsubishi-electric Industrial Systems Corporation, Chuo-ku, JP;

Inventors:

Akihiro Ichinose, Tokyo, JP;

Yoshihito Yamada, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/10 (2006.01); H05K 3/32 (2006.01); H05K 3/10 (2006.01); B23K 20/26 (2006.01); B23K 20/233 (2006.01); B23K 20/24 (2006.01); B23K 103/00 (2006.01); B23K 101/42 (2006.01); H01L 21/607 (2006.01); B23K 103/10 (2006.01); B23K 103/18 (2006.01); B23K 103/08 (2006.01); H01B 13/012 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 20/103 (2013.01); B23K 20/10 (2013.01); B23K 20/2333 (2013.01); B23K 20/24 (2013.01); B23K 20/26 (2013.01); H05K 3/103 (2013.01); H05K 3/328 (2013.01); B23K 2101/42 (2018.08); B23K 2103/08 (2018.08); B23K 2103/10 (2018.08); B23K 2103/18 (2018.08); B23K 2103/54 (2018.08); H01B 13/01209 (2013.01); H01L 24/78 (2013.01); H01L 2021/607 (2013.01); H01L 2224/7855 (2013.01); H01L 2224/78353 (2013.01); H01L 2224/78842 (2013.01); H01L 2224/78901 (2013.01); H01L 2224/78981 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/049 (2013.01); H05K 2203/0495 (2013.01);
Abstract

A bonding tool that executes an ultrasonic vibration processing of applying ultrasonic vibration to an application portion on a lead wire from a direct contact tip portion and a pair of press mechanisms having a pair of press rollers capable of performing a rotational operation. The pair of press mechanisms executes a press processing of pressing both sides of the application portion on the lead wire by the pair of press rollers at a time of execution of the ultrasonic vibration processing by the bonding tool and a movement processing of executing a rotational operation performed by the pair of press rollers to move the pair of press rollers on the lead wire while pressing the lead wire at a time of non-execution of the ultrasonic vibration processing.


Find Patent Forward Citations

Loading…