The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Nov. 21, 2017
Applicant:

The Johns Hopkins University, Baltimore, MD (US);

Inventors:

Steven M. Storck, Timonium, MD (US);

Rengaswamy Srinivasan, Ellicott City, MD (US);

Paul J. Biermann, Columbia, MD (US);

Assignee:

The Johns Hopkins University, Baltimore, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/02 (2006.01); B22F 1/00 (2006.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); B22F 10/20 (2021.01);
U.S. Cl.
CPC ...
B22F 1/025 (2013.01); B22F 1/004 (2013.01); B22F 1/0011 (2013.01); B22F 1/0018 (2013.01); B22F 1/0025 (2013.01); B22F 1/02 (2013.01); B22F 10/20 (2021.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B22F 2301/205 (2013.01); B22F 2302/25 (2013.01); B22F 2302/253 (2013.01); B22F 2304/10 (2013.01); Y02P 10/25 (2015.11);
Abstract

Functionalized metallic feedstock and three-dimensional articles formed therefrom via an additive manufacturing process are provided. The functionalized metallic feedstock includes a plurality of discrete metallic substrates including a first metallic substrate having a first surface area, in which at least a portion of the first surface area comprises a functionalizing agent selected to render the first metallic substrate resistant to corrosion.


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