The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Nov. 08, 2019
Applicant:
Altek Biotechnology Corporation, Hsinchu, TW;
Inventors:
Assignee:
ALTEK BIOTECHNOLOGY CORPORATION, Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H01R 12/62 (2011.01); H05K 3/34 (2006.01); H01R 12/72 (2011.01); H05K 1/11 (2006.01); H01R 12/58 (2011.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H01R 12/58 (2013.01); H01R 12/62 (2013.01); H01R 12/721 (2013.01); H05K 1/111 (2013.01); H05K 3/34 (2013.01);
Abstract
A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.