The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Apr. 20, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Inventors:
Youn-Gyu Han, Yongin-si, KR;
Sang-jae Lee, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/42 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0038 (2013.01); H05K 1/0373 (2013.01); H05K 3/0035 (2013.01); H05K 3/022 (2013.01); H05K 3/108 (2013.01); H05K 3/427 (2013.01); H05K 2201/0358 (2013.01); H05K 2203/0156 (2013.01);
Abstract
A copper clad laminate and a method to manufacture the same are provided. In one general aspect, a copper clad laminate include a first copper clad layer on a first surface of an insulating layer, and a second copper clad layer on a second surface of the insulating layer. The second copper clad layer includes polymer resin layer, a second copper layer, and a carrier foil layer.
Quick Actions:
Han, Youn-Gyu. (2021). Copper clad laminates and method for manufacturing a printed circuit board using the same (U.S. Patent No. 10952329). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10952329
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile