The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Mar. 11, 2020
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Young Kwan Lee, Suwon-si, KR;
Kyoung Jun Kim, Suwon-si, KR;
Yong Hoon Kim, Suwon-si, KR;
Seung Eun Lee, Suwon-si, KR;
Hak Chun Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
An electronic component embedded substrate includes a core layer having a first cavity and a second cavity on a first surface and a second surface of the core layer, respectively, the second surface opposite to the first surface in a thickness direction of the core layer; an electronic component disposed in the first cavity; a first insulating material covering at least a portion of the electronic component; a first wiring layer disposed on the first insulating material and connected to the electronic component; a built-in block disposed in the second cavity; and a second insulating material covering at least a portion of the built-in block.