The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Nov. 01, 2018
Applicant:
Finisar Corporation, Sunnyvale, CA (US);
Inventors:
Jianwei Mu, Pleasanton, CA (US);
Hongyu Deng, Saratoga, CA (US);
Assignee:
II-VI DELAWARE, INC., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01P 3/02 (2006.01); H01P 5/02 (2006.01); H01P 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H01P 3/003 (2013.01); H01P 3/026 (2013.01); H01P 5/028 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/0245 (2013.01); H05K 1/0253 (2013.01); H05K 1/0298 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/09336 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10803 (2013.01); H05K 2203/049 (2013.01);
Abstract
A communication module may include a communication ground layer. The communication module may also include a circuit board. The circuit board may be located proximate the communication ground layer. The circuit board may include a stitch layer. The stitch layer may be electrically coupled to the communication ground layer via a plurality of stitch layer vias. Additionally, the communication module may include multiple ground vias. The ground vias may be electrically coupled to a portion of the circuit board and to the communication ground layer.