logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10951508 B1

PDFFull Text
Date of Patent:
Mar. 16, 2021

Filed:

Jan. 09, 2018

End-to-end data path integrity validation at layer 2

Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Ross Caird, Kanata, CA;

Michael Watford, Kanata, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorneys:

Clements Bernard Walker

Lawrence A. Baratta, Jr.

Christopher L. Bernard

Primary Examiner:

Harry H Kim

Int. Cl.
CPC ...
H04L 12/26 (2006.01); H04J 3/14 (2006.01); H04L 29/12 (2006.01); H04L 12/46 (2006.01); H04J 3/16 (2006.01);
U.S. Cl.
CPC ...
H04L 43/50 (2013.01); H04J 3/14 (2013.01); H04J 3/1664 (2013.01); H04L 43/06 (2013.01); H04L 43/065 (2013.01); H04L 43/10 (2013.01); H04L 61/2592 (2013.01); H04J 2203/006 (2013.01); H04L 12/4641 (2013.01); H04L 43/16 (2013.01);
Abstract

Systems and methods of end-to-end data path integrity validation of a service with a data path at Layer 1 and Layer 2 implemented by a network element include, responsive to initiation of a test, messaging between network elements in the data path to coordinate defect and statistics collection at each of the network elements in the data path; receiving results for the defect and statistics collection from each of the network elements in the data path; and summarizing the received results to form a consolidated report for the test across all of the network elements in the data path.

Find Patent Forward Citations

Caird, Ross. (2021). End-to-end data path integrity validation at layer 2 (U.S. Patent No. 10951508). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10951508

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…