IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10950769 B1

PDFFull Text
Date of Patent:
Mar. 16, 2021

Filed:

Feb. 14, 2017

Light emitting diode (led) components including multiple led dies that are attached to lead frames

Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Michael John Bergmann, Raleigh, NC (US);

Colin Kelly Blakely, Franklinton, NC (US);

Arthur Fong-Yuen Pun, Raleigh, NC (US);

Jesse Colin Reiherzer, Raleigh, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:

Myers Bigel, P.A.

Primary Examiner:

Brigitte A Paterson

Int. Cl.
CPC ...
H01L 33/62 (2010.01); B23K 1/00 (2006.01); H01L 33/64 (2010.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); C22C 13/00 (2006.01); C22C 19/03 (2006.01); H01L 25/075 (2006.01); H01L 33/36 (2010.01); H01L 33/48 (2010.01); H01L 33/38 (2010.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B23K 1/0016 (2013.01); B23K 35/262 (2013.01); B23K 35/3033 (2013.01); C22C 13/00 (2013.01); C22C 19/03 (2013.01); H01L 25/0753 (2013.01); H01L 33/36 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 33/647 (2013.01); H01L 33/20 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

Find Patent Forward Citations

Loading…