The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Jul. 13, 2020
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Masahiko Kobayakawa, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/04 (2010.01); H01L 33/44 (2010.01); H01L 33/60 (2010.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/60 (2013.01); H01L 33/46 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/3025 (2013.01);
Abstract
An LED moduleis provided with an LED chipthat includes a sub-mount substratemade of Si and a semiconductor layerlaminated on the sub-mount substrate. The module also includes white resinthat does not transmit light from the semiconductor layerand that covers at least part of a side of the sub-mount substrate, where the side is connected to the surface on which the semiconductor layeris laminated. These arrangements enhance the brightness of the LED module