The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Aug. 23, 2019
Applicant:

Seoul Viosys Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jin Woong Lee, Gyeonggi-do, KR;

Kyoung Wan Kim, Gyeonggi-do, KR;

Tae Jun Park, Gyeonggi-do, KR;

Sang Won Woo, Gyeonggi-do, KR;

Assignee:

SEOUL VIOSYS CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/40 (2010.01); H01L 51/10 (2006.01); H01S 5/125 (2006.01);
U.S. Cl.
CPC ...
H01L 33/405 (2013.01); H01L 51/105 (2013.01); H01S 5/125 (2013.01);
Abstract

A flip chip type light emitting diode chip is disclosed. The light emitting diode chip includes a substrate; a first conductivity type semiconductor layer disposed on the substrate; a mesa disposed on a partial region of the first conductivity type semiconductor layer, and including an active layer and a second conductivity type semiconductor layer; a transparent electrode; a contact electrode laterally spaced apart from the mesa; a current spreader electrically connected to the transparent electrode; a first insulating reflection layer covering the substrate; and a second insulating reflection layer disposed under the substrate, and including the distributed Bragg reflector.


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