The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Mar. 20, 2019
Applicant:

Ford Global Technologies, Llc, Dearborn, MI (US);

Inventors:

Stuart C. Salter, White Lake, MI (US);

Paul Kenneth Dellock, Northville, MI (US);

Thorsten Warwel, Duisburg, DE;

Harry Lobo, Canton, MI (US);

David A. Brown, Plymouth, MI (US);

Assignee:

Ford Global Technologies, LLC, Dearborn, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/26 (2010.01); B60Q 1/26 (2006.01); B60Q 1/50 (2006.01); H01L 33/00 (2010.01); H01L 33/42 (2010.01); H01L 33/56 (2010.01); B29C 45/14 (2006.01); B29K 33/04 (2006.01); B29L 31/30 (2006.01); G05D 1/02 (2020.01);
U.S. Cl.
CPC ...
H01L 33/26 (2013.01); B60Q 1/2611 (2013.01); B60Q 1/2696 (2013.01); B60Q 1/50 (2013.01); H01L 33/005 (2013.01); H01L 33/42 (2013.01); H01L 33/56 (2013.01); B29C 45/14819 (2013.01); B29K 2033/04 (2013.01); B29L 2031/30 (2013.01); B60Q 2400/10 (2013.01); G05D 1/021 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A lighting assembly for a vehicle includes a polymeric layer and a first conductive layer coupled to the polymeric layer. A first metallic foil defined a plurality of first foil apertures. A semiconductor layer includes a plurality of perovskites. A second conductive layer is coupled to the semiconductor layer. A second metallic foil defines a plurality of second foil apertures. The lighting assembly includes transparent overmold, extending through the plurality of first foil apertures, the first and second conductive layers, the semiconductor layer, and the plurality of second foil apertures to contact the polymeric layer.


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