The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Oct. 26, 2018
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Masaki Tamura, Shiojiri, JP;

Hitoshi Abe, Matsumoto, JP;

Takeshi Fujii, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 29/10 (2006.01); H01L 29/08 (2006.01); H01L 27/07 (2006.01); H01L 29/417 (2006.01); H01L 29/861 (2006.01); H01L 21/263 (2006.01); H01L 29/868 (2006.01); H01L 29/66 (2006.01); H01L 29/36 (2006.01); H01L 29/32 (2006.01); H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/24 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 21/263 (2013.01); H01L 27/0716 (2013.01); H01L 27/0727 (2013.01); H01L 29/0603 (2013.01); H01L 29/0804 (2013.01); H01L 29/0834 (2013.01); H01L 29/1095 (2013.01); H01L 29/32 (2013.01); H01L 29/36 (2013.01); H01L 29/41708 (2013.01); H01L 29/66136 (2013.01); H01L 29/739 (2013.01); H01L 29/861 (2013.01); H01L 29/868 (2013.01); H01L 29/8611 (2013.01); H01L 29/8613 (2013.01); H01L 29/1602 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/24 (2013.01);
Abstract

In a surface layer of a rear surface of the semiconductor substrate, an n-type cathode region and a p-type cathode region are each selectively provided. The n-type cathode region and the p-type cathode region constitute a cathode layer and are adjacent to each other along a direction parallel to the rear surface of the semiconductor substrate. The n-type cathode region and the p-type cathode region are in contact with a cathode electrode. In an n-type drift layer, plural n-type FS layers are provided at differing depths deeper from the rear surface of the semiconductor substrate than is the cathode layer. With such configuration, in a diode, a tradeoff relationship of forward voltage reduction and reverse recovery loss reduction may be improved and soft recovery may be realized.


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