The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Sep. 13, 2018
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Chunyan Xie, Beijing, CN;

Jianwei Li, Beijing, CN;

Liqiang Chen, Beijing, CN;

Song Zhang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 51/56 (2006.01); G09F 9/30 (2006.01); H01L 51/52 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3244 (2013.01); G09F 9/301 (2013.01); H01L 27/3276 (2013.01); H01L 51/0097 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 2251/5338 (2013.01);
Abstract

The present disclosure provides a flexible display device, a display apparatus, and a method for manufacturing the flexible display device. The flexible display device comprises a flexible display panel, a hardened layer, and an integrated circuit layer with bumps. A front surface of the flexible display panel is provided with a circuit bonding region. The flexible display panel comprises a first flexible substrate. The hardened layer is on the first flexible substrate. The hardened layer is at a position corresponding to the circuit bonding region. The integrated circuit layer is bonded to the circuit bonding region by the bumps.


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