The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Oct. 24, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Kee-Su Jeon, Suwon-si, KR;
Min-Jae Seong, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/4763 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H05K 1/113 (2013.01); H05K 3/28 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/1058 (2013.01);
Abstract
A printed circuit board includes an insulating material with a bump pad buried in one surface, an adhesive layer stacked on the one surface of the insulating material, an insulating layer stacked on the adhesive layer, and a cavity passing through both of the adhesive layer and the insulating layer to expose the bump pad, wherein the cavity has a cross-sectional area decreasing in a direction toward the insulating material.
Quick Actions:
Jeon, Kee-Su. (2021). Printed circuit board and package structure (U.S. Patent No. 10950587). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10950587
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile