The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Jun. 02, 2017
Applicant:
Continental Teves Ag & Co. Ohg, Frankfurt, DE;
Inventors:
Manfred Goll, Glauburg, DE;
Martin Haverkamp, Frankfurt am Main, DE;
Michael Schulmeister, Groß-Zimmem, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); G01D 11/24 (2006.01); H05K 3/40 (2006.01); H05K 5/00 (2006.01); H01R 12/72 (2011.01); H01L 21/56 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); G01D 11/245 (2013.01); H01L 23/3121 (2013.01); H01L 24/24 (2013.01); H05K 3/4007 (2013.01); H05K 5/0078 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24175 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1532 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/19105 (2013.01); H01R 12/721 (2013.01); H05K 1/117 (2013.01); H05K 3/4015 (2013.01); H05K 2201/10318 (2013.01);
Abstract
A sensor including a system-in-package module, wherein electrical contacts can be contact-connected by way of a mating connector. An associated method and an associated sensor arrangement are also disclosed.