The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Jul. 15, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Katsunari Nakazawa, Kyoto, JP;
Takanori Uejima, Kyoto, JP;
Motoji Tsuda, Kyoto, JP;
Yuji Takematsu, Kyoto, JP;
Dai Nakagawa, Kyoto, JP;
Tetsuro Harada, Kyoto, JP;
Masahide Takebe, Kyoto, JP;
Naoya Matsumoto, Kyoto, JP;
Yoshiaki Sukemori, Kyoto, JP;
Mitsunori Samata, Kyoto, JP;
Yutaka Sasaki, Kyoto, JP;
Yuki Fukuda, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.