The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Mar. 29, 2017
Mitsubishi Electric Corporation, Tokyo, JP;
Koichiro Nishizawa, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A ring-like sealing frame () and a bump () are simultaneously formed on a main surface of a first substrate () by patterning a metal paste. A ring-like protrusion () having a smaller width than a width of the sealing frame () is formed on a main surface of a second substrate (). The main surface of the first substrate () and the main surface of the second substrate () are aligned to face each other. The sealing frame () is bonded to the protrusion (), and the bump () is electrically bonded to the second substrate (). A height of the protrusion () is 0.4 to 0.7 times a distance between the first substrate () and the second substrate () after bonding.