The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Sep. 03, 2019
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Eric M. Prophet, Santa Barbara, CA (US);

Florian G. Herrault, Agoura Hills, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/04 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 21/288 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/2885 (2013.01); H01L 21/4871 (2013.01); H01L 21/52 (2013.01); H01L 21/76898 (2013.01); H01L 23/04 (2013.01); H01L 23/367 (2013.01); H01L 2223/6683 (2013.01);
Abstract

A microwave electronic component comprising a substrate having top and bottom substrate surfaces; the substrate comprising an aperture between the top and bottom substrate surfaces; a metallic heat sink filling the aperture; a microwave integrated circuit having a top circuit surface with at least one microwave signal port and a bottom circuit surface in contact with the metallic heat sink; a signal line comprising at least a metallic via between the top and bottom substrate surfaces, and a top signal conductor arranged between the microwave signal port and the metallic via; wherein the dimensions and location of the metallic via are chosen such that the metallic via forms, together with the metallic heat sink, a first impedance-matched non-coaxial transmission line.


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