The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

May. 16, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Ryoung-han Kim, Plano, TX (US);

Kwanyong Lim, Plano, TX (US);

Youn Sung Choi, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 27/11 (2006.01); H01L 21/84 (2006.01); H01L 27/088 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/823431 (2013.01); H01L 21/845 (2013.01); H01L 27/0886 (2013.01); H01L 27/1108 (2013.01); H01L 29/66795 (2013.01); H01L 21/3081 (2013.01);
Abstract

An integrated circuit containing finFETs may be formed with fins extending above isolation oxide. A first finFET and a second finFET have exposed fin heights which are different by at least 25 percent. The exposed fin height is a vertical height of a sidewall of the fin above the isolation oxide. Gates are formed over the fins. In one version, a fin height of the first finFET is less than a fin height of the second finFET; a thickness of the isolation oxide adjacent to fins of the first finFET and the second finFET is substantially uniform. The fin height is the height of a top of the fin above the substrate. In another version, the isolation oxide is thinner at the first finFET than at the second finFET; the fin heights of the first finFET and the second finFET are substantially equal.


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