The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

May. 17, 2019
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Masahito Tanabe, Annaka, JP;

Michihiro Sugo, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 183/04 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/768 (2006.01); H01L 25/065 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 183/04 (2013.01); H01L 21/0209 (2013.01); H01L 21/304 (2013.01); H01L 21/76897 (2013.01); H01L 25/0657 (2013.01); C08G 77/20 (2013.01); C08G 77/70 (2013.01); C08G 77/80 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68386 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01);
Abstract

A method for manufacturing a thin substrate uses a temporary adhesive film for substrate processing for temporarily adhesion of a substrate to a support on a surface of the substrate opposite to a surface to be processed, the temporary adhesive film for substrate processing containing a siloxane bond-containing polymer having a weight average molecular weight of 3,000 to 500,000 in an amount of 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass; and includes: (a) laminating the temporary adhesive film for substrate processing onto the support and/or the surface of the substrate opposite to the surface to be processed; (b) bonding thereof under reduced pressure; (c) processing the substrate by grinding or polishing; (d) treating the substrate with acid or base; (e) other processing; (f) separating the processed substrate from the support; and (g) cleaning the substrate.


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