The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Jul. 11, 2018
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventors:
Jun Takagi, Yokkaichi, JP;
Shinichi Hirasawa, Mie, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/00 (2012.01); H01L 21/67 (2006.01); B24B 37/015 (2012.01); B24B 37/04 (2012.01); B24B 37/20 (2012.01); B24B 57/02 (2006.01); B24B 37/10 (2012.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B24B 37/015 (2013.01); B24B 37/042 (2013.01); B24B 37/107 (2013.01); B24B 37/20 (2013.01); B24B 57/02 (2013.01);
Abstract
In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad, a polishing head configured to hold a substrate to be polished by the polishing pad, and a polishing liquid feeder configured to feed a polishing liquid to the polishing pad. The apparatus further includes a heat exchanger configured to be placed on the polishing pad and control temperatures of the polishing pad and the polishing liquid, and one or more protruding portions provided on a side face or a bottom face of the heat exchanger.