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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10948821 B1

PDFFull Text
Expired
Date of Patent:
Mar. 16, 2021

Filed:

Mar. 24, 2017

Photosensitive resin composition

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yohei Kiuchi, Otsu, JP;

Yu Shoji, Otsu, JP;

Kimio Isobe, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Chanceity N Robinson

Int. Cl.
CPC ...
G03F 7/037 (2006.01); G03F 7/027 (2006.01); C09D 183/08 (2006.01); C09D 183/04 (2006.01); G03F 7/075 (2006.01); C08L 83/08 (2006.01); C08G 77/26 (2006.01); C08G 77/20 (2006.01); C08L 65/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/037 (2013.01); C08L 83/08 (2013.01); C09D 183/04 (2013.01); C09D 183/08 (2013.01); G03F 7/027 (2013.01); G03F 7/0755 (2013.01); G03F 7/0757 (2013.01); C08G 77/20 (2013.01); C08G 77/26 (2013.01); C08L 65/00 (2013.01);
Abstract

A photosensitive resin composition includes an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B) which constitutes a polyfunctional (meth)acryl group-containing silane condensate (B1) having a weight average molecular weight of 1,000 to 20,000, and having a plurality of structures represented by Formula (1), which is a condensate of compounds having a structure represented by Formula (1) and at least one structure selected from Formula (2-1), Formula (2-2), and Formula (2-3).

Find Patent Forward Citations

Kiuchi, Yohei. (2021). Photosensitive resin composition (U.S. Patent No. 10948821). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10948821

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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