The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Feb. 09, 2012
Applicants:
Daijitsu Harada, Joetsu, JP;
Masaki Takeuchi, Joetsu, JP;
Inventors:
Daijitsu Harada, Joetsu, JP;
Masaki Takeuchi, Joetsu, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/60 (2012.01); G03F 7/00 (2006.01); B82Y 40/00 (2011.01); B82Y 10/00 (2011.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 1/60 (2013.01);
Abstract
A circular mold-forming substrate of 125-300 mm diameter having a surface on which a topological pattern is to be formed is provided wherein the thickness of the substrate has a variation of up to 2 μm within a circle having a diameter of 125 mm.