The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

May. 02, 2018
Applicant:

Sicoya Gmbh, Berlin, DE;

Inventors:

Stefan Meister, Berlin, DE;

Moritz Grehn, Berlin, DE;

Sven Otte, Hohen Neuendorf, DE;

Sebastian Höll, Berlin, DE;

Assignee:

SICOYA GMBH, Berlin, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/32 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4214 (2013.01); G02B 6/423 (2013.01); G02B 6/428 (2013.01); G02B 6/4243 (2013.01); G02B 6/4249 (2013.01);
Abstract

The invention relates to a photonic component () having a photonically integrated chip () and a fibre mounting (), wherein the fibre mounting () has: at least one groove (), into which an optical fibre () is placed, and at least one mirror surface (), which reflects radiation (S) from the fibre () in the direction of the photonically integrated chip (). According to the invention a chip stack () comprising at least two chips is arranged between the photonically integrated chip () and the fibre mounting (), the chip stack () has at least two through holes () and in each case a guide pin (), which positions the chip stack () and the fibre mounting () relative to one another, passes through the at least two through holes () of the chip stack ().


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