The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Nov. 25, 2019
Applicants:

Inventec (Pudong) Technology Corporation, Shanghai, CN;

Inventec Corporation, Taipei, TW;

Inventors:

Shin-Hsin Hsien, Taipei, TW;

Chih-Kai Yang, Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 3/02 (2006.01); H01L 23/427 (2006.01); H01L 23/367 (2006.01); F28D 15/04 (2006.01); F28D 15/00 (2006.01); F28D 15/02 (2006.01); G06F 1/20 (2006.01); H01L 23/467 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28F 3/025 (2013.01); F28D 15/00 (2013.01); F28D 15/0266 (2013.01); F28D 15/04 (2013.01); F28D 15/043 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01); G06F 1/203 (2013.01); H01L 23/467 (2013.01); H05K 7/20136 (2013.01);
Abstract

A heat dissipation system configured to be in thermal contact with a heat source. The heat dissipation system includes a centrifugal fan, a heat pipe, a heat dissipater, and a heat conduction assembly. The centrifugal fan includes a housing and an impeller. The housing has an accommodation space, an inlet, and an outlet. The inlet and the outlet are connected to the accommodation space. The impeller is located in the accommodation space. The heat pipe is configured to be in thermal contact with the heat source. The heat dissipater is located at the outlet and in thermal contact with the heat pipe. The heat conduction assembly includes a first part configured for the heat source to be mounted thereon and in thermal contact with the heat source, and a second part disposed on the housing and partially located in the accommodation space.


Find Patent Forward Citations

Loading…