The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Jan. 17, 2019
Applicants:

Daikin Industries, Ltd., Osaka, JP;

Goodman (Daikin) Manufacturing Company, L.p., Cypress, TX (US);

Inventors:

Masahiro Oka, Osaka, JP;

Junichi Shimoda, Osaka, JP;

Takashi Shimamura, Osaka, JP;

Yuuji Yamada, Osaka, JP;

Hideyuki Nakagawa, Houston, TX (US);

Hiroyuki Imada, Osaka, JP;

David Palazzolo, Houston, TX (US);

Joseph Kelly Hearnsberger, Katy, TX (US);

Sriram Venkat, Katy, TX (US);

Chris Bellshaw, Houston, TX (US);

John Clements, Atlanta, GA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F24F 11/46 (2018.01); F25B 30/02 (2006.01); F24F 1/08 (2011.01); F24F 1/32 (2011.01); F24F 3/06 (2006.01); F24F 11/64 (2018.01); F24F 11/65 (2018.01); F24F 11/80 (2018.01); F24H 3/00 (2006.01); G05B 19/042 (2006.01); F25B 49/02 (2006.01); F25B 13/00 (2006.01); F24F 110/10 (2018.01); F24F 110/20 (2018.01); F24F 110/22 (2018.01); F24F 140/30 (2018.01); F24F 140/50 (2018.01); F24F 140/60 (2018.01);
U.S. Cl.
CPC ...
F24F 11/46 (2018.01); F24F 1/08 (2013.01); F24F 1/32 (2013.01); F24F 3/065 (2013.01); F24F 11/64 (2018.01); F24F 11/65 (2018.01); F24F 11/80 (2018.01); F24H 3/00 (2013.01); F25B 13/00 (2013.01); F25B 30/02 (2013.01); F25B 49/02 (2013.01); G05B 19/042 (2013.01); F24F 2110/10 (2018.01); F24F 2110/20 (2018.01); F24F 2110/22 (2018.01); F24F 2140/30 (2018.01); F24F 2140/50 (2018.01); F24F 2140/60 (2018.01); F24F 2221/54 (2013.01); F25B 2313/0233 (2013.01); F25B 2600/0253 (2013.01); F25B 2600/2513 (2013.01); G05B 2219/2614 (2013.01);
Abstract

An HVAC system is provided. Embodiments of the present disclosure generally relate to an HVAC system in which multiple indoor units are coupled to central outdoor unit, where at least one of the indoor units is configured to provide conditioned air through ductwork and at least one indoor unit is configured to provide conditioned air without ductwork. Moreover, a gas furnace can be provided in the system, for harsher environments that benefit from more robust heating. Additional systems, devices, and methods are also disclosed.


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