The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Nov. 27, 2017
General Electric Company, Schenectady, NY (US);
Kudum Shinde, Bangalore, IN;
Praveen Sharma, Bangalore, IN;
Shashank Suresh Puranik, Bangalore, IN;
Shivam Mittal, Bangalore, IN;
Charles Stanley Orkiszewski, Cincinnati, OH (US);
Carl Lawrence MacMahon, Cincinnati, OH (US);
Anthony Michael Metz, Harrison, OH (US);
Brian Drummond, Swampscott, MA (US);
General Electric Company, Schenectady, NY (US);
Abstract
Embodiments are generally provided of a gas turbine engine including a rotor assembly comprising a shaft extended along a longitudinal direction, in which a compressor rotor and a turbine rotor are each coupled to the shaft; a casing surrounding the rotor assembly, in which the casing defines a first opening radially outward of the compressor rotor, the turbine rotor, or both, and a second opening radially outward of the compressor rotor, the turbine rotor, or both; a first manifold assembly coupled to the casing at the first opening; a second manifold assembly coupled to the casing at the second opening, in which the first manifold, the casing, and the second manifold together define a thermal circuit in thermal communication with the rotor assembly; and a fluid flow device in fluid communication with the first manifold assembly, in which the fluid flow device provides a flow of fluid to the first manifold assembly and through the thermal circuit, and further wherein the flow of fluid egresses the thermal circuit at the second manifold assembly.