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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10947426 B1

PDFFull Text
Date of Patent:
Mar. 16, 2021

Filed:

Jan. 30, 2018

Aqueous bonding composition

Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Atsushi Kakuda, Osaka, JP;

Yoshio Yoshida, Osaka, JP;

Assignee:

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:

Sun Hee Lehmann

Primary Examiner:

Colin W Slifka

Int. Cl.
CPC ...
C09J 105/00 (2006.01); C08L 97/02 (2006.01); C09D 105/00 (2006.01); B32B 21/04 (2006.01); C08K 3/16 (2006.01); C08K 3/30 (2006.01); C08K 3/32 (2006.01); C13K 11/00 (2006.01);
U.S. Cl.
CPC ...
C09J 105/00 (2013.01); B32B 21/042 (2013.01); C08K 3/16 (2013.01); C08K 3/30 (2013.01); C08K 3/32 (2013.01); C08L 97/02 (2013.01); C09D 105/00 (2013.01); C13K 11/00 (2013.01); C08K 2003/166 (2013.01); C08K 2003/3054 (2013.01); C08K 2003/322 (2013.01); C09J 2203/00 (2013.01);
Abstract

Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength. The aqueous bonding composition can be usefully used to produce a wood-based material. Further, a wood-based material obtainable by using the aqueous bonding composition is provided.

Find Patent Forward Citations

Kakuda, Atsushi. (2021). Aqueous bonding composition (U.S. Patent No. 10947426). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10947426

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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