The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Oct. 04, 2016
Applicant:

Daicel Corporation, Osaka, JP;

Inventors:

Hiroyoshi Koduma, Himeji, JP;

Hiroki Tanaka, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 29/10 (2006.01); C08J 5/18 (2006.01); C09J 11/06 (2006.01); C09J 11/08 (2006.01); C09J 201/06 (2006.01); C09J 4/06 (2006.01); C09J 7/30 (2018.01); C09J 167/00 (2006.01); C09J 177/00 (2006.01); C09J 129/10 (2006.01); C09J 175/00 (2006.01); C09J 129/14 (2006.01);
U.S. Cl.
CPC ...
C09J 11/06 (2013.01); C08J 5/18 (2013.01); C08L 29/10 (2013.01); C09J 4/06 (2013.01); C09J 7/30 (2018.01); C09J 11/08 (2013.01); C09J 129/10 (2013.01); C09J 167/00 (2013.01); C09J 175/00 (2013.01); C09J 177/00 (2013.01); C09J 201/06 (2013.01); C08J 2300/22 (2013.01); C08J 2329/14 (2013.01); C08J 2367/00 (2013.01); C08J 2375/04 (2013.01); C08J 2377/00 (2013.01); C09J 129/14 (2013.01); C09J 2203/326 (2013.01); C09J 2301/502 (2020.08); C09J 2400/22 (2013.01); C09J 2467/00 (2013.01); C09J 2475/00 (2013.01); C09J 2477/00 (2013.01);
Abstract

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy.


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