The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Feb. 15, 2019
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Sarah J. Vella, Milton, CA;

Guiqin Song, Milton, CA;

Chad Steven Smithson, Toronto, CA;

Naveen Chopra, Oakville, CA;

Kurt Halfyard, Mississauga, CA;

Biby Esther Abraham, Mississauga, CA;

Assignee:

XEROX CORPORATION, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 11/08 (2006.01); C09J 125/18 (2006.01); C09J 129/14 (2006.01); C09J 161/28 (2006.01); C09J 163/00 (2006.01); C08K 5/17 (2006.01); H01B 1/22 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 11/08 (2013.01); C09J 125/18 (2013.01); C09J 129/14 (2013.01); C09J 161/28 (2013.01); C09J 163/00 (2013.01); C08K 3/08 (2013.01); C08K 5/17 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/005 (2013.01); H01B 1/22 (2013.01);
Abstract

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.


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