The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Aug. 24, 2017
Applicant:
Daicel Corporation, Osaka, JP;
Inventors:
Yasunobu Nakagawa, Himeji, JP;
Shinya Yabuno, Ohtake, JP;
Assignee:
DAICEL CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); H01L 23/29 (2006.01); H01L 33/56 (2010.01); C08G 77/04 (2006.01); C08K 5/5419 (2006.01); C08G 77/00 (2006.01); C08G 77/50 (2006.01); H01L 33/54 (2010.01); C08G 77/20 (2006.01); C08G 77/08 (2006.01); C08G 77/12 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08G 77/045 (2013.01); C08K 5/5419 (2013.01); H01L 23/296 (2013.01); H01L 33/56 (2013.01); C08G 77/08 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/50 (2013.01); C08G 77/80 (2013.01); C08L 2203/206 (2013.01); H01L 33/54 (2013.01);
Abstract
An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts.