IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10947111 B1

PDFFull Text
Date of Patent:
Mar. 16, 2021

Filed:

Jan. 19, 2018

Method for frequency trimming a microelectromechanical resonator

Applicant:

Georgia Tech Research Corporation, Atlanta, GA (US);

Inventors:

Benoit Hamelin, Atlanta, GA (US);

Farrokh Ayazi, Atlanta, GA (US);

Assignee:

Georgia Tech Research Corporation, Atlanta, GA (US);

Attorneys:

Troutman Pepper Hamilton Sanders LLP

Ryan A. Schneider

Primary Examiner:

Paul D Kim

Int. Cl.
CPC ...
H04R 31/00 (2006.01); G01R 3/00 (2006.01); B81C 1/00 (2006.01); B23K 26/20 (2014.01); H03H 3/013 (2006.01); B23K 26/34 (2014.01); B23K 26/351 (2014.01); B23K 26/00 (2014.01); H03H 3/04 (2006.01); B23K 26/354 (2014.01); B81B 3/00 (2006.01); H01L 41/253 (2013.01); B23K 103/00 (2006.01); B23K 103/08 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B81C 1/0065 (2013.01); B23K 26/0006 (2013.01); B23K 26/20 (2013.01); B23K 26/34 (2013.01); B23K 26/351 (2015.10); B23K 26/354 (2015.10); B81B 3/007 (2013.01); H03H 3/013 (2013.01); H03H 3/04 (2013.01); B23K 2101/40 (2018.08); B23K 2103/08 (2018.08); B23K 2103/52 (2018.08); B81B 2201/0242 (2013.01); B81B 2201/0271 (2013.01); B81C 2201/0166 (2013.01); B81C 2201/0167 (2013.01); B81C 2201/0169 (2013.01); H01L 41/253 (2013.01);
Abstract

Embodiments of the present disclosure can include a method for frequency trimming a microelectromechanical resonator, the resonator comprising a substrate and a plurality of loading elements layered on a surface of the substrate, the method comprising: selecting a first loading element of the plurality of loading elements, the first loading element being layered on a surface of a region of interest of the substrate; heating the first loading element and substrate within the region of interest to a predetermined temperature using an optical energy source, causing the first loading element to diffuse into the substrate; and cooling the region of interest to form a eutectic composition layer bonding the loading element and the substrate within the region of interest.

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