The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
May. 16, 2019
Applicant:
Tesa SE, Norderstedt, DE;
Inventors:
Katja Meyer, Hamburg, DE;
Matthias Seibert, Hamburg, DE;
Assignee:
TESA SE, Norderstedt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/24 (2018.01); C09J 7/25 (2018.01); C09J 7/29 (2018.01); C09J 133/08 (2006.01); B32B 7/02 (2019.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); C09J 7/38 (2018.01); B32B 3/26 (2006.01); B32B 11/04 (2006.01); C09J 7/35 (2018.01); B32B 7/12 (2006.01); B29C 73/10 (2006.01); B32B 7/027 (2019.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 3/266 (2013.01); B32B 11/046 (2013.01); B32B 27/20 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); C09J 7/29 (2018.01); C09J 7/385 (2018.01); C09J 133/08 (2013.01); B29C 73/10 (2013.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 2250/04 (2013.01); B32B 2250/24 (2013.01); B32B 2274/00 (2013.01); B32B 2307/718 (2013.01); B32B 2307/7265 (2013.01); B32B 2323/00 (2013.01); B32B 2323/04 (2013.01); B32B 2331/04 (2013.01); B32B 2377/00 (2013.01); B32B 2395/00 (2013.01); B32B 2398/00 (2013.01); B32B 2405/00 (2013.01); B32B 2605/00 (2013.01); C09J 7/24 (2018.01); C09J 7/241 (2018.01); C09J 7/25 (2018.01); C09J 7/35 (2018.01); C09J 7/38 (2018.01); C09J 2301/122 (2020.08); C09J 2301/162 (2020.08); C09J 2301/302 (2020.08); C09J 2301/304 (2020.08); C09J 2301/41 (2020.08); C09J 2423/006 (2013.01); C09J 2423/046 (2013.01); C09J 2431/006 (2013.01); C09J 2433/00 (2013.01); C09J 2477/006 (2013.01); C09J 2495/006 (2013.01); Y10T 428/20 (2015.01); Y10T 428/21 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/2826 (2015.01); Y10T 428/2848 (2015.01); Y10T 428/2891 (2015.01); Y10T 428/31757 (2015.04); Y10T 428/31855 (2015.04); Y10T 428/31909 (2015.04);
Abstract
Diecuts are configured for permanent closing of holes and have a carrier comprising an assembly of at least two polymeric films. An upper film of the at least two polymeric films has a basis weight of at least 1.0 kg/mand a lower film of the at least two polymeric films consisting of at least two layers, wherein a first layer is in the form of a polymeric film and faces the upper film, and a second layer is in the form of a functional layer with a side of the lower film, facing away from the upper film, bears an applied adhesive composition.