The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Oct. 29, 2019
Coretech System Co., Ltd., Chupei, TW;
National Tsing Hua University, Hsinchu, TW;
Yuan Yao, Hsinchu, TW;
Tzu-Heng Chiu, Hsinchu, TW;
Rong-Yeu Chang, Chupei, TW;
Chia-Hsiang Hsu, Chupei, TW;
Chih-Wei Wang, Chupei, TW;
Shih-Po Sun, Chupei, TW;
Sung-Wei Huang, Chupei, TW;
Hsun Yang, Chupei, TW;
Tsai-Heng Tsai, Chupei, TW;
Coretech System Co., Ltd., Chupei, TW;
National Tsing Hua University, Hsinchu, TW;
Abstract
The present disclosure provides a measurement method for a molding system comprising an upper mold and a lower mold forming a mold cavity. The method includes applying a pressure difference to a molding resin for driving the molding resin to flow into a preform in the mold cavity; detecting a flow front of the molding resin at a first position and a second position in the mold cavity; and calculating a flowing property of the molding resin based on the first position, the second position, a travelling time of the flow front from the first position to the second position, and the pressure difference.