The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Sep. 11, 2017
Applicant:

Impossible Objects, Llc, Northbrook, IL (US);

Inventors:

Robert Swartz, Highland Park, IL (US);

John Bayldon, Evanston, IL (US);

Buckley Crist, Wilmette, IL (US);

Eugene Gore, Des Plaines, IL (US);

Assignee:

Impossible Objects, Inc., Northbrook, IL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/30 (2006.01); B22F 7/06 (2006.01); B22F 10/00 (2021.01); B29C 64/232 (2017.01); B29C 64/295 (2017.01); B33Y 50/02 (2015.01); B22F 7/04 (2006.01); B29C 67/08 (2006.01); C22C 47/20 (2006.01); C22C 49/14 (2006.01); C22C 47/02 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/147 (2017.01); B33Y 70/00 (2020.01); B29C 70/52 (2006.01); B33Y 40/00 (2020.01); B22F 7/08 (2006.01); B32B 15/00 (2006.01); B22F 3/24 (2006.01); B22F 10/10 (2021.01); B22F 3/105 (2006.01);
U.S. Cl.
CPC ...
B29C 67/08 (2013.01); B22F 7/064 (2013.01); B22F 10/00 (2021.01); B29C 64/147 (2017.08); B29C 64/232 (2017.08); B29C 64/295 (2017.08); B29C 70/30 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); C22C 47/025 (2013.01); C22C 47/20 (2013.01); C22C 49/14 (2013.01); B22F 3/24 (2013.01); B22F 7/04 (2013.01); B22F 7/08 (2013.01); B22F 10/10 (2021.01); B22F 2003/1051 (2013.01); B22F 2007/042 (2013.01); B22F 2007/045 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B29C 70/528 (2013.01); B32B 15/00 (2013.01); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); C22C 2200/02 (2013.01); C22C 2200/06 (2013.01);
Abstract

A method and apparatus for resistive heating usable in composite-based additive manufacturing is disclosed. The method includes providing a prepared stack of substrate sheets, placing the stack between electrode assemblies of a compression device, applying a current to thereby heat the stack to a final temperature to liquefy applied powder, compressing the stack to a final height, cooling the stack, and removing the cooled, compressed stack from the compression device. The apparatus comprises at least two plates, a power supply for providing current, a first electrode assembly and a second electrode assembly.


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